This product is made of polytetrafluoroethylene and glass fiber cloth according to the electrical performance requirements of microwave circuits. This product is the first generation of Wangling polytetrafluoroethylene glass fiber cloth substrate. It was developed in the early 1980s and meets the requirements of high-frequency substrate standards at that time. In order to improve the material performance and stability, our company recommends F4BM and F4BME series products.

This product is made of glass fiber cloth, polytetrafluoroethylene resin and polytetrafluoroethylene film through scientific preparation and strict process. Its electrical performance is improved to a certain extent than F4B, mainly due to the wider range of dielectric constant, low dielectric loss, increased insulation resistance, and more stable performance, which can replace foreign products of the same type. F4BM and F4BME have the same dielectric layer, but the copper foil used together is different: F4BM is matched with forward rotating ED copper foil, which is suitable for applications without PIM indicators; F4BME with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss. F4BM and F4BME precisely adjust the dielectric constant by adjusting the ratio between polytetrafluoroethylene and glass fiber cloth, which not only achieves low loss, but also enhances the dimensional stability of the material; The higher the dielectric constant is, the higher the proportion of glass fiber is, so the dimensional stability is better, the coefficient of thermal expansion is lower, the temperature fluctuation is better, and the dielectric loss is increased.

This product is made of glass fiber cloth, nano-ceramic filling and polytetrafluoroethylene resin after scientific preparation and strict process pressing. This series of products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss. F4BTM and F4BTME have the same dielectric layer, but different copper foils are used together: F4BTM is matched with forward rotating ED copper foils, which is suitable for applications without PIM indicators; F4BTME with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss.

This product is made of glass fiber cloth, polytetrafluoroethylene resin and nanometer ceramic film through scientific preparation and strict process. This series of products is based on the F4BM dielectric layer. The material surface uses nanometer ceramic film, which improves the surface insulation resistance. The dielectric layer is gray white, more beautiful and more consistent in appearance. F4BM-2-A and F4BME-2-A have the same dielectric layer, but different copper foils are used together: F4B-2-A is matched with forward conversion ED copper foils, which is suitable for applications without PIM indicators; F4BME-2-A with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss.

The upgraded products of F4BTMS series F4BTM series, based on which, have made a technical breakthrough in the material formula and manufacturing process. A large number of ceramics have been added to the material, and ultra-thin and ultra-fine glass fiber cloth has been used to enhance the material performance, and the dielectric constant is wider. It is a spaceflight grade high reliability material, which can replace the same type of foreign products. A small amount of ultra-thin ultra-fine glass fiber cloth is reinforced, and a large number of uniform special nano-ceramics are mixed with polytetrafluoroethylene resin, which minimizes the glass fiber effect during the propagation of electromagnetic waves, reduces the dielectric loss, and enhances the dimensional stability. The X/Y/Z anisotropy of the material is reduced, the use frequency is increased, the electrical strength is improved, and the thermal conductivity is improved. The material also has excellent low thermal expansion coefficient and stable dielectric temperature characteristics. F4BTMS series is equipped with RTF low roughness copper foil as standard, which reduces conductor loss and has excellent peeling strength. It can be used with copper or aluminum base. F4BTMS294 can be used with buried 50 Ω resistance copper foil to form a resistance film plate. The circuit board can be processed with standard PTFE plate technology. The excellent mechanical and physical properties of the plate are suitable for multi-layer, high-multi-layer and backplane processing; At the same time, it shows excellent machinability in processing dense holes and fine lines.

The dielectric layer of the TFA series of PTFE ceramic composite dielectric substrate products is composed of PTFE resin and ceramics. Instead of using glass fiber cloth to make preforms, a new process is used to make preforms, which are then pressed by a special pressing process. With excellent electrical, thermal and mechanical properties of the same class of dielectric constant, it is a spaceflight grade high frequency and high reliability material, and can replace foreign products of the same type. This series of substrates does not contain glass fiber cloth, and uses a large number of uniform special nano-ceramics mixed with resin. There is no glass fiber effect when the electromagnetic wave propagates, the frequency stability is excellent, the dielectric loss is the lowest at the same level, the X/Y/Z anisotropy of the material is reduced to the minimum, and the material also has the same low thermal expansion coefficient as copper foil, stable dielectric temperature characteristics, etc. The series has four choices of dielectric constant: 2.94, 3.0, 6.15 and 10.2. TFA series is equipped with RTF low roughness copper foil as standard, which reduces conductor loss and has excellent peeling strength. It can also be used with calendered copper foil. TFA series can be used with copper or aluminum base. TFA294 and TFA300 can be combined with buried 50 Ω resistance copper foil to form a resistance film plate. The circuit board can be processed with standard PTFE plate technology. The excellent mechanical and physical properties of the plate are suitable for multi-layer, high-multi-layer and backplane processing; At the same time, it shows excellent machinability in processing dense holes and fine lines.

The WL-CT series of organic polymer ceramic glass fiber cloth copper-clad sheet is a thermosetting resin system high-frequency material. The medium layer is composed of hydrocarbon resin, ceramic and glass fiber cloth. It has low loss performance and meets the requirements of high-frequency design. At the same time, the processability of PCB can be processed with reference to FR4 material. Compared with PTFE material, it is easier to process, and it is more convenient for line stability and consistency, and can replace foreign products of the same type. Hydrocarbon resin and composite ceramics have good characteristics of low loss, high temperature resistance and temperature stability, which make the dielectric constant and loss of this series of materials have stable temperature characteristics, low thermal expansion coefficient, and high TG value greater than 280 ℃. The dielectric constants of this series of products are 3.0, 3.3, 3.38, 3.48, 4.38 and 6.15. This series of materials is matched with forward rotating ED copper foil or reverse RTF copper foil. RTF copper foil has excellent PIM index, reducing conductor loss and insertion loss; RTF copper foil is treated with adhesive backing, and the material thickness is increased by 0.018mm (0.7mil), which makes RTF copper foil have good adhesion. This series can be matched with aluminum substrate to form aluminum base high-frequency materials The circuit board can be processed by referring to the FR4 plate process technology. The excellent mechanical and physical properties of the plate enable the plate to be pressed multiple times, which is suitable for multi-layer, high-multi-layer and backboard processing; At the same time, it shows excellent machinability in processing dense holes and fine lines.

The prepreg is made of hydrocarbon resin, ceramic filler and glass fiber cloth through scientific preparation and processing. It is a thermosetting high-frequency prepreg developed on the basis of WL-CT series plates. It can be mixed with most of the core plates in the industry to achieve the design requirements of high frequency and high speed multilayer plates. The product has low dielectric constant and dielectric loss, and the pressing temperature is low. The ordinary vacuum press for PCB can complete the pressing.

WL-PP280 is a kind of ceramic composite membrane adhesive sheet without glass fiber cloth reinforcement (see Figure 1 below), which is coated with thermosetting resin coating with excellent comprehensive performance on both sides of the ceramic filled polytetrafluoroethylene film. It combines the excellent dielectric properties of PTFE ceramic film and the excellent comprehensive properties of thermosetting resin coating, and meets the requirements of increasingly complex high-frequency microwave multilayer plate for semi-cured sheet, such as multiple lamination process According to the requirements of plug hole, low fluidity, low temperature lamination, good adhesion and operability, WL-PP280 is superior to the traditional semi-curing sheet for high frequency board (such as Speed C, FEP, PFA, hydrocarbon/glass fiber cloth, etc.), greatly improving the qualification rate and reliability of high frequency microwave multilayer board, and is a semi-curing sheet material with excellent comprehensive cost performance.