F4BTMS series is the upgraded product of F4BTM series, on the basis of which, a technical breakthrough has been made in material formulation and production process. A large amount of ceramics has been added to the material, and ultra-thin and ultra-fine glass fiber cloth has been used to enhance the material performance, and the dielectric constant is wider. The product is an astronautically grade and highly reliable material and can replace similar foreign products. A small amount of ultra-thin ultra-fine glass fiber cloth acts as a reinforcement, while a large number of uniform special nano-ceramics is mixed with PTFE resin, so that the glass fiber effect of electromagnetic wave propagation is reduced to a minimum, the dielectric loss is reduced, the dimensional stability is enhanced, the anisotropy of material in X/Y/Z direction is reduced, the frequency of use is increased, electrical strength is increased, and thermal conductivity is increased. The material at the same time has excellent low thermal expansion coefficient and stable dielectric temperature characteristics. The F4BTMS series comes standard with RTF low roughness copper foil, which reduces conductor loss while having excellent peel strength, and can be used with copper or aluminum base. F4BTMS294 can be matched with buried 50Ω resistive copper foil to form a resistive film sheet. The circuit board can be processed with standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; it also shows excellent processability in terms of dense holes and fine line processing.

The compositions of the dielectric layer of PTFE ceramic composite dielectric substrate TFA series are PTFE resin and ceramic. The series products do not use the glass fiber cloth dipping method to make prefabricated sheet, but use a new technology to make prefabricated sheet, and finally are pressed by a special pressing process. With the same level of dielectric constant excellent electrical properties, thermal properties, mechanical properties, they are aerospace grade high frequency high reliability materials, and can replace similar foreign products. This substrate series mix PTFE resin with a large number of uniform special nano-ceramics, without glass fiber cloth, therefore, there is no glass fiber effect when electromagnetic wave propagates. The properties of the materials include excellent frequency stability, the lowest dielectric loss at the same level，and the lowest anisotropy in X / Y / Z direction. The materials at the same time have low thermal expansion coefficient and stable dielectric temperature characteristic as the same as copper foil. The dielectric constants of this series are 2.94, 3.0, 6.15, 10.2. The TFA series comes standard with RTF low roughness copper foil, which reduces conductor loss while providing excellent peel strength. TFA294 and TFA300 can be matched with buried 50Ω resistive copper foil to form resistive film sheets. The circuit board can be processed by standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; at the same time, it shows excellent processability in the processing of dense holes and fine lines.

The WL-CT series of organic polymer ceramic fiberglass cloth copper clad plates is a high-frequency material of a thermosetting resin system. The dielectric layer is composed of hydrocarbon resin, ceramics, and fiberglass cloth, which has low loss performance and meets the requirements of high-frequency design. At the same time, the processability of PCB can refer to FR4 material processing. Compared with PTFE material processing, it is simpler, easier to process. The WL-CT series can replace similar foreign products. Hydrocarbon resin and composite ceramics have good characteristics of low loss, high temperature resistance, temperature stability, etc., which make the dielectric constant and loss of this series of materials have stable temperature characteristics, low thermal expansion coefficient, and the material has a high TG value greater than 280 ℃. The dielectric constants of this series of products are 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15 to choose from. This series of materials is paired with ED copper foil or reverse RTF copper foil. RTF copper foil has excellent PIM indicators, reducing conductor losses and insertion losses; RTF copper foil is treated with adhesive backing, which increases the material thickness by 0.018mm (0.7mil), making RTF copper foil have good adhesion. This series can be paired with aluminum substrates to form aluminum based high-frequency materials The circuit board can be processed referring to FR4 board process technology. The excellent mechanical and physical properties of the board enable it to be pressed multiple times, making it suitable for multi-layer, high multi-layer, and backboard processing; At the same time, it exhibits excellent machinability in processing dense holes and fine lines.

The F4BXW series is made of random short glass fibers laminated with PTFE resin. It is an aerospace-grade high-reliability material that can replace similar foreign products. The material has excellent properties of precise dielectric constant value and ultra-low loss value. The selected special random short glass fibers are uniformly dispersed in PTFE resin, basically no anisotropy, avoiding the frequency fluctuation caused by the effect of glass fiber cloth. Ultra-low loss value and stability make the use frequency higher. The addition of special random short glass fibers provides better through-hole reliability and solvent resistance than pure glass fiber cloth products. The F4BXW series comes standard with RTF copper foil, which has high peel strength and can be used with copper or aluminum cladding. The circuit boards can be processed with standard PTFE board technology, which shows excellent processability in the processing of dense holes, ultra-fine lines, and electroplated gold lines.