WL-PP280 is a kind of ceramic composite membrane adhesive sheet without glass fiber cloth reinforcement (see Figure 1 below), which is coated with thermosetting resin coating with excellent comprehensive performance on both sides of the ceramic filled polytetrafluoroethylene film. It combines the excellent dielectric properties of PTFE ceramic film and the excellent comprehensive properties of thermosetting resin coating, and meets the requirements of increasingly complex high-frequency microwave multilayer plate for semi-cured sheet, such as multiple lamination process According to the requirements of plug hole, low fluidity, low temperature lamination, good adhesion and operability, WL-PP280 is superior to the traditional semi-curing sheet for high frequency board (such as Speed C, FEP, PFA, hydrocarbon/glass fiber cloth, etc.), greatly improving the qualification rate and reliability of high frequency microwave multilayer board, and is a semi-curing sheet material with excellent comprehensive cost performance.

The F4BTD series is a high thermal conductivity PTFE resin high-frequency substrate, reinforced with glass fiber cloth and containing a large amount of high thermal conductivity special ceramics. It features low loss and high thermal conductivity, and is a new generation of high-frequency materials developed for applications requiring low insertion loss and high heat dissipation efficiency. It can replace similar foreign products. This series has three models: F4BTD350, F4BTD350S, and F4BTD615, with typical dielectric constant values/loss values/thermal conductivity of 3.5/0.002/0.72W/(M.K), 3.5/0.0016/1.25W/(M.K), and 6.15/0.002/1.1W/(M.K), respectively. The excellent low loss and thermal conductivity performance increase the microwave power tolerance, extend the service life of devices, and make them more suitable for high-temperature and long-term operation, ensuring equipment reliability and low-cost maintenance. At the same time, the material has the advantages of low thermal expansion coefficient, dimensional stability, high electrical strength, and high insulation performance, making PCB processing easier, through-hole reliability higher, soldering faults lower, component matching better, and environmental adaptability stronger. The circuit boards can be processed using standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multi-layer, high multi-layer, and backplane processing. At the same time, it shows excellent processability in dense hole and fine line processing.