The dielectric layer of the TFA series of PTFE ceramic composite dielectric substrate products is composed of PTFE resin and ceramics. Instead of using glass fiber cloth to make preforms, a new process is used to make preforms, which are then pressed by a special pressing process. With excellent electrical, thermal and mechanical properties of the same class of dielectric constant, it is a spaceflight grade high frequency and high reliability material, and can replace foreign products of the same type.

This series of substrates does not contain glass fiber cloth, and uses a large number of uniform special nano-ceramics mixed with resin. There is no glass fiber effect when the electromagnetic wave propagates, the frequency stability is excellent, the dielectric loss is the lowest at the same level, the X/Y/Z anisotropy of the material is reduced to the minimum, and the material also has the same low thermal expansion coefficient as copper foil, stable dielectric temperature characteristics, etc.

The series has four choices of dielectric constant: 2.94, 3.0, 6.15 and 10.2.

TFA series is equipped with RTF low roughness copper foil as standard, which reduces conductor loss and has excellent peeling strength. It can also be used with calendered copper foil. TFA series can be used with copper or aluminum base.

TFA294 and TFA300 can be combined with buried 50 Ω resistance copper foil to form a resistance film plate.

The circuit board can be processed with standard PTFE plate technology. The excellent mechanical and physical properties of the plate are suitable for multi-layer, high-multi-layer and backplane processing; At the same time, it shows excellent machinability in processing dense holes and fine lines.