The WL-CT series of organic polymer ceramic fiberglass cloth copper clad plates is a high-frequency material of a thermosetting resin system. The dielectric layer is composed of hydrocarbon resin, ceramics, and fiberglass cloth, which has low loss performance and meets the requirements of high-frequency design. At the same time, the processability of PCB can refer to FR4 material processing. Compared with PTFE material processing, it is simpler, easier to process. The WL-CT series can replace similar foreign products.

Hydrocarbon resin and composite ceramics have good characteristics of low loss, high temperature resistance, temperature stability, etc., which make the dielectric constant and loss of this series of materials have stable temperature characteristics, low thermal expansion coefficient, and the material has a high TG value greater than 280 ℃.

The dielectric constants of this series of products are 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15 to choose from.

This series of materials is paired with ED copper foil or reverse RTF copper foil. RTF copper foil has excellent PIM indicators, reducing conductor losses and insertion losses; RTF copper foil is treated with adhesive backing, which increases the material thickness by 0.018mm (0.7mil), making RTF copper foil have good adhesion.

This series can be paired with aluminum substrates to form aluminum based high-frequency materials

The circuit board can be processed referring to FR4 board process technology. The excellent mechanical and physical properties of the board enable it to be pressed multiple times, making it suitable for multi-layer, high multi-layer, and backboard processing; At the same time, it exhibits excellent machinability in processing dense holes and fine lines.