This product is made of glass fiber cloth, polytetrafluoroethylene resin and polytetrafluoroethylene film through scientific preparation and strict process. Its electrical performance is improved to a certain extent than F4B, mainly due to the wider range of dielectric constant, low dielectric loss, increased insulation resistance, and more stable performance. The product can replace foreign products of the same type. F4BM and F4BME have the same dielectric layer, but the copper foil used together is different: F4BM and ED copper foil are suitable for applications without PIM indicators; F4BME with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss. F4BM and F4BME precisely adjust the dielectric constant by adjusting the ratio between polytetrafluoroethylene and glass fiber cloth, which not only achieves low loss, but also enhances the dimensional stability of the material.The higher the dielectric constant is, the higher the proportion of glass fiber is.Therefore the dimensional stability is better; the coefficient of thermal expansion is lower; the temperature fluctuation is better; and the dielectric loss is increased.

This product is made of glass fiber cloth, nano ceramic filler, and polytetrafluoroethylene resin through scientific preparation and strict lamination control. This series of products is based on the F4BM dielectric layer, with the addition of nanoscale ceramics with high dielectric constant and low loss. Therefore, they obtain higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, and better thermal conductivity, while maintaining the characteristics of low loss. F4BTM and F4BTME have the same dielectric layer, but different copper foils are used : F4BTM with ED copper foils are suitable for applications without PIM indicators requirement; F4BTME with reverse RTF copper foil has excellent PIM indicators, more accurate line control, and lower conductor loss. This series of products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss. F4BTM and F4BTME have the same dielectric layer, but different copper foils are used together: F4BTM is matched with forward rotating ED copper foils, which is suitable for applications without PIM indicators; F4BTME with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss.

F4BTMS series is the upgraded product of F4BTM series, on the basis of which, a technical breakthrough has been made in material formulation and production process. A large amount of ceramics has been added to the material, and ultra-thin and ultra-fine glass fiber cloth has been used to enhance the material performance, and the dielectric constant is wider. The product is an astronautically grade and highly reliable material and can replace similar foreign products. A small amount of ultra-thin ultra-fine glass fiber cloth acts as a reinforcement, while a large number of uniform special nano-ceramics is mixed with PTFE resin, so that the glass fiber effect of electromagnetic wave propagation is reduced to a minimum, the dielectric loss is reduced, the dimensional stability is enhanced, the anisotropy of material in X/Y/Z direction is reduced, the frequency of use is increased, electrical strength is increased, and thermal conductivity is increased. The material at the same time has excellent low thermal expansion coefficient and stable dielectric temperature characteristics. The F4BTMS series comes standard with RTF low roughness copper foil, which reduces conductor loss while having excellent peel strength, and can be used with copper or aluminum base. F4BTMS294 can be matched with buried 50Ω resistive copper foil to form a resistive film sheet. The circuit board can be processed with standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; it also shows excellent processability in terms of dense holes and fine line processing.

The compositions of the dielectric layer of PTFE ceramic composite dielectric substrate TFA series are PTFE resin and ceramic. The series products do not use the glass fiber cloth dipping method to make prefabricated sheet, but use a new technology to make prefabricated sheet, and finally are pressed by a special pressing process. With the same level of dielectric constant excellent electrical properties, thermal properties, mechanical properties, they are aerospace grade high frequency high reliability materials, and can replace similar foreign products. This substrate series mix PTFE resin with a large number of uniform special nano-ceramics, without glass fiber cloth, therefore, there is no glass fiber effect when electromagnetic wave propagates. The properties of the materials include excellent frequency stability, the lowest dielectric loss at the same level，and the lowest anisotropy in X / Y / Z direction. The materials at the same time have low thermal expansion coefficient and stable dielectric temperature characteristic as the same as copper foil. The dielectric constants of this series are 2.94, 3.0, 6.15, 10.2. The TFA series comes standard with RTF low roughness copper foil, which reduces conductor loss while providing excellent peel strength. TFA294 and TFA300 can be matched with buried 50Ω resistive copper foil to form resistive film sheets. The circuit board can be processed by standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; at the same time, it shows excellent processability in the processing of dense holes and fine lines.