This product is made of glass fiber cloth, polytetrafluoroethylene resin and polytetrafluoroethylene film through scientific preparation and strict process. Its electrical performance is improved to a certain extent than F4B, mainly due to the wider range of dielectric constant, low dielectric loss, increased insulation resistance, and more stable performance. The product can replace foreign products of the same type. F4BM and F4BME have the same dielectric layer, but the copper foil used together is different: F4BM and ED copper foil are suitable for applications without PIM indicators; F4BME with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss. F4BM and F4BME precisely adjust the dielectric constant by adjusting the ratio between polytetrafluoroethylene and glass fiber cloth, which not only achieves low loss, but also enhances the dimensional stability of the material.The higher the dielectric constant is, the higher the proportion of glass fiber is.Therefore the dimensional stability is better; the coefficient of thermal expansion is lower; the temperature fluctuation is better; and the dielectric loss is increased.

This product is made of glass fiber cloth, nano ceramic filler, and polytetrafluoroethylene resin through scientific preparation and strict lamination control. This series of products is based on the F4BM dielectric layer, with the addition of nanoscale ceramics with high dielectric constant and low loss. Therefore, they obtain higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, and better thermal conductivity, while maintaining the characteristics of low loss. F4BTM and F4BTME have the same dielectric layer, but different copper foils are used : F4BTM with ED copper foils are suitable for applications without PIM indicators requirement; F4BTME with reverse RTF copper foil has excellent PIM indicators, more accurate line control, and lower conductor loss. This series of products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss. F4BTM and F4BTME have the same dielectric layer, but different copper foils are used together: F4BTM is matched with forward rotating ED copper foils, which is suitable for applications without PIM indicators; F4BTME with reverse RTF copper foil has excellent PIM index, more accurate line control and lower conductor loss.