The compositions of the dielectric layer of PTFE ceramic composite dielectric substrate TFA series are PTFE resin and ceramic. The series products do not use the glass fiber cloth dipping method to make prefabricated sheet, but use a new technology to make prefabricated sheet, and finally are pressed by a special pressing process. With the same level of dielectric constant excellent electrical properties, thermal properties, mechanical properties, they are aerospace grade high frequency high reliability materials, and can replace similar foreign products. This substrate series mix PTFE resin with a large number of uniform special nano-ceramics, without glass fiber cloth, therefore, there is no glass fiber effect when electromagnetic wave propagates. The properties of the materials include excellent frequency stability, the lowest dielectric loss at the same level，and the lowest anisotropy in X / Y / Z direction. The materials at the same time have low thermal expansion coefficient and stable dielectric temperature characteristic as the same as copper foil. The dielectric constants of this series are 2.94, 3.0, 6.15, 10.2. The TFA series comes standard with RTF low roughness copper foil, which reduces conductor loss while providing excellent peel strength. TFA294 and TFA300 can be matched with buried 50Ω resistive copper foil to form resistive film sheets. The circuit board can be processed by standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; at the same time, it shows excellent processability in the processing of dense holes and fine lines.