F4BTMS series is the upgraded product of F4BTM series, on the basis of which, a technical breakthrough has been made in material formulation and production process. A large amount of ceramics has been added to the material, and ultra-thin and ultra-fine glass fiber cloth has been used to enhance the material performance, and the dielectric constant is wider. The product is an astronautically grade and highly reliable material and can replace similar foreign products. A small amount of ultra-thin ultra-fine glass fiber cloth acts as a reinforcement, while a large number of uniform special nano-ceramics is mixed with PTFE resin, so that the glass fiber effect of electromagnetic wave propagation is reduced to a minimum, the dielectric loss is reduced, the dimensional stability is enhanced, the anisotropy of material in X/Y/Z direction is reduced, the frequency of use is increased, electrical strength is increased, and thermal conductivity is increased. The material at the same time has excellent low thermal expansion coefficient and stable dielectric temperature characteristics. The F4BTMS series comes standard with RTF low roughness copper foil, which reduces conductor loss while having excellent peel strength, and can be used with copper or aluminum base. F4BTMS294 can be matched with buried 50Ω resistive copper foil to form a resistive film sheet. The circuit board can be processed with standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; it also shows excellent processability in terms of dense holes and fine line processing.