◈ Dielectric constant can be selected in the range of 3 to 25 according to the circuit requirements, and is stable. Commonly used dielectric constant are 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, 20; dielectric loss is small, the loss increases at higher frequencies, but the change is not significant within 10G.

◈ Long-term use temperature is -100℃～+150℃, excellent resistance to low temperature, when the temperature exceeds 180℃, the material may be deformed, the copper foil falls off, and the electrical properties change greatly.

◈ The thinnest thickness is 0.5mm, thickness is abundant and can be customized.

◈ Ideal for space applications, low outgassing.

◈ Ideal material for Beidou, bullet load, fuze, miniaturized antenna.

◈ The adhesion of copper foil and media is firmer than the vacuum coating of ceramic substrate, and the material is easy to be machined and can be drilled, turned, ground, sheared, engraved, etc., which cannot be compared with ceramic substrate.

◈ The circuit board is easy to process and can be processed according to the processing method of thermoplastic material with high yield and the processing cost is greatly reduced compared with the ceramic substrate; in view of the characteristics of the material, it is generally not recommended for multilayer board processing, if multilayer board processing is carried out, please choose the low temperature type bonding sheet and fully consider the feasibility.

◈ The material is not suitable for thermal shock test at 260℃ and cannot be wave soldered; welding is recommended for manual welding with constant temperature soldering iron, reflow soldering is generally not recommended, if reflow soldering is carried out, the maximum setting temperature should not exceed 200℃, and please fully consider the feasibility and stability.