●F4BTMS-2
●Teflon woven glass fabric planar resistor copper-clad laminates F4BDZ294
●Teflon woven glass fabric with ceramic filler copper-clad laminates F4BTME-1/2
●Teflon woven glass fabric with ceramic filler copper-clad laminates F4BTM-1/2
●Teflon woven glass fabric with ceramic membrane copper-clad laminates F4BM-2-A
●Teflon woven glass fabric copper-clad laminates with high permittivity F4BM-1/2
●Teflon woven glass fabric copper-clad laminates（F4BME-2-A ）
●Teflon woven glass fabric copper clad laminates with ceramic filledF4BT-1/2
●Teflon woven glass fabric copper-clad laminates（F4B-1/2）
●Teflon woven glass fabric copper-clad laminates with high permittivity F4BK-1/2
●Teflon woven glass fabric copper-clad laminates
●Teflon woven glass fabric copper-clad laminates with high permittivity F4BMX-1/2
●Teflon woven glass fabric copper-clad laminates with high permittivity F4BME-1/2
●Teflon woven glass fabric planar resistor copper-clad laminates F4BDZ294
●Metallic Teflon woven glass fabric copper-clad laminates F4B-1/Al(CU)
●Insulative teflon woven glass fabric copper-clad laminates F4T-1/2

This product is the raw material before the Teflon woven glass fabric copper-clad laminates. Dipping the Teflon dispersion liquid on the alkali-free woven glass fabric, after drying, baking and sintering, the microwave dielectric material is formulated. This product is characterized by some features, such as heat-resistantance, insulation, low loss, excellent electrical performance, inadhesion, and is extensively used in some areas, such as electronics, motor, aviation, textile, chemical and food industry, etc.. In the area of microwave devices, it can be used as the bonding layer between multi-layer PCBs.
●Teflon woven glass fabric F4B-N / F4B-T
●Teflon woven glass fabric

●A special microwave composite dielectric copper-clad substrateTPH-1/2
●Microwave dielectric copper-clad substrate TP-1/2
●Teflon ceramic dielectric substrate TF-1/2